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Getian Stage Light Flip chip cob high lumen density cool white 300w cob chips

这里可以自定义设置
Getian Stage Light Flip chip cob high lumen density cool white 300w cob chips
Model:
GT-FC300X3-1.1
MOQ:
50PCS
Payment:
T/T, Western union, Credit Card
Lead Time:
5-7 Working Days
Port:
Shenzhen
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Product Description

◈  High Reliability and Stability. Ceramic base with flip chip mounted, no gold wire bonding.
◈  High heat conductivity red copper substrate . High temperature eutectic welding technique.
◈  Reliable raw materials applied with super fast heat transfer.
◈  Patented phosphor coating techonology. Outstanding Projecting Performance.
◈  High power & lux density with super even light distribution. Minimum distance in-between chips to achieve surface emitting effect. Extremely small LES optimized for focused lighting purpose.
◈  Flexible Application Features
Equipped with temperature sensor and quick connector.
A wide power range from 10W to 500W optional.
Notes: Recommended CCT 8000-8500K. (2600-2900K/2900-3200K/4000-4500K/6000-6500K available. <6000K, Max CRI 95, FC500 only 8000-9000K is available)
.

Product Parameter

Product Type

LES

(mm)

CCT

(K)

CRI 

φ

(lm)

Power
(W)
VF
(V)

IF

(A)

Chip Array
GT-FC15X3-1.02.6*2.68000-8500701000-15001512-141.2SP0401
GT-FC20X3-1.02.9*2.98000-8500701500-18002012-141.5SP0401
GT-FC40X3-1.04.3*4.38000-8500703000-35004012-143SP0404
GT-FC60X3-1.0-20204.3*4.38000-8500704000-45006012-144SP0404
 
Product TypeLES
(mm)
CCT
(K)
CRI φ
(lm)
Power
(W)
VF
(V)
IF
(A)
Chip Array
GT-FC60X3-1.16.66*6.668000-8500704500-50006015-193.75SP0505
GT-FC90X3-1.16.66*6.668000-8500706300-72009015-195.5SP0505
GT-FC150X3-1.19.64*9.648000-85007010000-1200015021-256.7SP0707
GT-FC300X3-1.1 13.48*13.488000-85007020000-2200030030-3610SP1010
 
Product TypeLES
(mm)
CCT
(K)
CRI φ
(lm)
Power
(W)
VF
(V)
IF
(A)
Chip Array
GT-FC60X3-3.06.66*6.668000-8500704500-50006015-193.75SP0505
GT-FC90X3-3.06.66*6.668000-8500706300-72009015-195.5SP0505
GT-FC150X3-3.09.64*9.648000-85007010000-1200015021-256.7SP0707
GT-FC300X3-3.012.84*12.848000-85007020000-2200030030-3610SP1010
这里可以自定义设置

Product Features

ALN Ceramic Base + Red Copper Base with Eutectic Welding technique.Square & Small LES, suitable for focused lighting applications such as stage light and projectors. Flip Chip LED Chips applied & Phosphor just on chip surface. Equiped with thermistor and temperature sensor. High power & lux density with ultimate reliability.

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