Home  > Product  > Stage LED Module 60-800W  > LED Module GT-FC20-500W  > 

FCST 230W LED Module, Round LES9.66

这里可以自定义设置
FCST 230W LED Module, Round LES9.66
Model:
GT-FCST230X3-1.0
MOQ:
50
Payment:
T/T, Western union, Credit Card
Lead Time:
5-7 Working Days
Port:
Shenzhen
参数暂无数据

Add success, do you want to check your shopping cart?

暂无分享
该产品后台详情无内容
这里可以自定义设置

Product Description

◈  High Reliability and Stability. Ceramic base with flip chip mounted, no gold wire bonding.
◈  High heat conductivity red copper substrate . High temperature eutectic welding technique.
◈  Reliable raw materials applied with super fast heat transfer.
◈  Patented phosphor coating techonology. Outstanding Projecting Performance.
◈  High power & lux density with super even light distribution. Minimum distance in-between chips to achieve surface emitting effect. Extremely small round LES optimized for focused lighting purpose.
◈  Flexible Application Features

 Equipped with temperature sensor and quick connector.

 

Product Parameter

Product   Type LES
  (mm)
CCT
  (K)
CRI  φ
  lm
Power
  (W)
VF
  (V)
IF
  (A)
Chip Array
GT-FCST150X3-1.0 7.44*7.44 8000-9000 70 10000-12000 150 24-28 6 SP0804
GT-FCST230X3-1.0 9.96*9.96 8000-9000 70 18000-20000 230 38-45 5.9 SP1304


这里可以自定义设置

Product Features

ALN Ceramic Base + Red Copper Base with Eutectic Welding technique.Square & Small LES, suitable for focused lighting applications such as stage light and projectors. Flip Chip LED Chips applied & Phosphor just on chip surface. Equiped with thermistor and temperature sensor. High power & lux density with ultimate reliability.

社媒暂无评论
Chat Online
Chat Online
Chat Online inputting...