◈ High Reliability and Stability. Ceramic base with flip chip mounted, no gold wire bonding.
◈ High heat conductivity red copper substrate . High temperature eutectic welding technique.
◈ Reliable raw materials applied with super fast heat transfer.
◈ Patented phosphor coating techonology. Outstanding Projecting Performance.
◈ High power & lux density with super even light distribution. Minimum distance in-between chips to achieve surface emitting effect. Extremely small round LES optimized for focused lighting purpose.
◈ Flexible Application Features
Equipped with temperature sensor and quick connector.
ALN Ceramic Base + Red Copper Base with Eutectic Welding technique.Square & Small LES, suitable for focused lighting applications such as stage light and projectors. Flip Chip LED Chips applied & Phosphor just on chip surface. Equiped with thermistor and temperature sensor. High power & lux density with ultimate reliability.