◈ Red Copper Star Substrate with fast heat dissipation.
◈ ALN ceramic chip base with Eutectic Welding technique.
◈ Super Small LES, suitable for focused lighting applications such as stage light and projectors.
◈ Flip chip chip applied/or Osram Vertical Chips.
◈ High power intensity & high lux density with ultimate reliability.
◈ Thermal-electric isolation copper substrate, safe and stable, easy for assembly.
◈ Application: LED logo projector; Image projector; Profile Light; Moving Head Light; Spot Light; Gobo led lights; car headlights, etc.
Osram Vertical chip led module, only Illuminate on the top ( light in one side, so the light directivity will be better than other leds. Super high intensity. Super high reliability.
Small lighting emitting surface. Super heat dissipating performance.